| Initial examination of product | Meets requirements of product drawing. | Visual inspection per product drawing. Per EIA-364-18 |
| Final examination of product | Meets visual requirements. | Visual inspection per product drawing. Per EIA-364-18 |
| Low Level Contact Resistance | 25 m max. for 30 pin gold plated product.
30 m max. for 15 pin and gold flash plated product. | Per EIA 364-23.
Subject mated contacts assembled in housing to 20 mV open circuit at 100 mA maximum. |
| Dielectric Withstanding Voltage | No creeping discharge or flashover shall occur.
Leak current: 1mA Max. | Per EIA 364-20
Apply 1000V AC for 1 minute at sea level at adjacent contacts and between contacts and metal shell of unmated connector assemblies. |
| Insulation Resistance | 5000 M minimum initial.
1000 M minimum final. | Per EIA 364-21.
500V DC for 1 minute, test between adjacent contacts of unmated connector assemblies |
| Temperature Rise | 30C maximum temperature rise at specified current. | EIA 364-70
Measure temperature rise vs current.
All positions series wired individually forming a single circuit in each connector.
Rated current when all contacts are loaded |
| Vibration, Random | No discontinuities greater than 1 microsecond. | Per EIA 364-28, condition V, test letter F
Duration 15 minutes.
15 minutes in each of three mutually per planes. |
| Physical Shock | No discontinuities greater than 1 microsecond.
No physical damage. | Per EIA 364-27
Subject mated connectors to 50 G's half-sine shock pulses of 11 milliseconds duration. 3 shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. |
| Mating Force | 150N max. | Per EIA 364-13.
Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. |
| Unmating Force | 150N max. | Per EIA 364-13.
Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. |
| Durability | See note. | Per EIA 364-09
Mate and unmate connector assemblies for 100 cycles for gold flash and 15pin gold plating , 500 cycles for 30 pin gold plating at maximum rate of 200 cycles per hour. |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Per EIA 364-52
For wave soldering
Temperature: 245C5C
Immersion duration : 5 seconds
After 1 hour 5 minutes steam aging |
| Thermal Shock | See note. | Per EIA 364-32, test condition VII
Subject mated connectors to 5 cycles Between -55C and +105C with each cycle consisting of 30 minute dwells at -55 and 105C. The transition between temperatures was less than 5 minutes. |
| Humidity | See note. | Per EIA 364-31 Method II test condition A
Subject mated connectors to 96 hours at 40C with 90% to 95% RH. |
| Temperature Life | See note. | Per EIA 364-17 test condition IV Method A
Subject mated connectors to temperature life at 105C for 500 hours. |
| Salt Spray | See note. | Per EIA 364-26
Mated connector
Salt concentration: 5%, 352 C,
8 hours |
